Specialists in mmWave technology solutions for space

High value manufacturing for HAPS and LEO applications.

Filtronic are experts in providing high performing RF into complex markets such as near space. We have access to the latest automated microelectronic assembly equipment including: fully automated epoxy dispense; die and component attach; wire and ball bonding; air cavity packaging; in-house testing and world leading process control for full traceability.

We lead the field when it comes to maximising RF performance, system integration and thermal management. At our Sedgefield facility, we specialise in mmWave design, manufacture and test. The facility is 1200m2, with 200m2 each of clean rooms and engineering labs. In total nearly 500m2 of ESD safe work area. We can design up to 300GHz, manufacture up to 115GHz and test up to 140GHz.

RF in ‘near space

Along with low earth orbit (LEO) satellite constellations, high-altitude pseudo satellites (HAPS) operating in the stratosphere, have the potential to address the challenge of providing ubiquitous connectivity. The speed and capacity demands placed on mobile telecommunications infrastructure are increasing exponentially. By 2023, fixed broadband speeds are expected to more than double, while 5G speeds will be 13 times higher than the average mobile connection. Filtronic plays a vital role in equipping global telecommunications networks for the future. As experts in designing components for 5G XHaul, we support the industry in moving up the frequency spectrum from E-Band to W-Band and D-Band, to deliver the extra bandwidth required.

Filtronic is an expert in delivering highly integrated Size, Weight and Power (SWaP) improvements, fundamental for the new space era that will drive the economy of tomorrow.

Manufacturing process

Autobonding

Die attach

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