High quality hybrid assembly and manufacturing services

Epoxy dispense

At Sedgefield, we complement our manufacturing process with a range of fully automated epoxy dispensers. Featuring single or dual dispensing head for optimal convenience and speed, these machines provide a highly adaptable solution that connects perfectly to our die attach. Their X-Y-Z motion system is capable of accurate dispensing to 15 microns with reliable precision of 3 sigma.

Die attach

We also have a range of Die attach machines that provide incredible precision of up to +/-10 microns at 3 sigma. We have dedicated one machine for R&D purposes to help increase efficiency, and our machines can work with a variety of packaging, from Gel packs and waffles packs to Reels and wafers. Additionally, we have two production lines for high-mix product assembly with die sizes from 0.17mm to 50mm, making the rapid assembly of multi-chip modules possible.

Automatic bonding

Our state-of-the-art auto-bonding machines guarantees an impressive degree of reliability and efficiency. With a bond placement accuracy of +/- 2 microns at 3 sigma, it is suitable to bond 15 micron wire, up to 50 micron wire. This gives us the capability to bond onto pads as small as 31microns.