The need to strengthen supply chains within the UK has assumed greater prominence recently, following disruption caused by the pandemic, Brexit and global geopolitical shifts. The complexity of global supply chains means that most countries rely on importing essential components, skills or hardware to deliver critical services. But in a world where protectionism is on the increase – whether manifested overtly or via national standards and regulations – the UK urgently needs to develop sovereignty in critical aspects of technology and build greater supply chain resilience.

Securing critical industries

Recognising this, the government has taken positive steps in the right direction, with initiatives such as Project Defend focusing on creating reliable supplies of strategically important components within the UK. Such government backing will be essential to secure the investment needed to develop internal supply chains for vital industries, so the UK is less exposed to global shortages. A significant challenge, however, will be finding ways to maintain and build competitive advantage in a world where ideas and intellectual property are flowing less freely across international boundaries.

Unique SME network  

At Filtronic, we believe the answer lies in mobilising the huge network of specialist SMEs in the UK, who have the particular skills, knowledge, design capabilities and manufacturing facilities to deliver critical components for the UK. Skills, experience and know-how like this can’t be bought off the shelf, and we’re fortunate in the UK to have some of the world’s leading experts in advanced technologies to keep us ahead of the competition.

In our own business, we have 40 years’ experience of developing unique radio frequency (RF) components and sub-systems for high-performance communication networks. Our products today are the result of accumulated knowledge and innovation, honed over 40+ years of adapting to new frequencies and changing industry demands.

Defence and telecoms focus

The UK government is focusing on the defence and telecommunications infrastructure sectors in its initial efforts to build strategic autonomy. This is where the many specialist SMEs in the UK can really help to build robust networks and enable the UK to capitalise on emerging opportunities. In telecoms infrastructure, for example, we don’t have a giant company able to directly replace Huawei, but we do have many niche suppliers that can deliver all the essential pieces of the jigsaw.

Emerging opportunities in space

The next big step in telecommunications is likely to involve satellite communications. The UK government has invested in OneWeb, with the ambition of developing satellite constellations to compete directly with the likes of SpaceX and Amazon. Filtronic already has the RF technology to support satellite communications, and can help the UK build the valuable space capabilities that are likely to be in great demand globally in the years ahead.

Maximise existing capabilities

The initiatives established by government so far are extremely welcome, and there is clearly momentum behind the drive to invest in UK supply chains. Now is the time to maximise the unique breadth and depth of skills, intellectual property and capabilities that already exist in the UK. This is vital not only to secure our critical industries and enable them to thrive in a rapidly changing world, but also to build the strong technology base the UK needs to remain open to global trade and to build new relationships worldwide.

To learn more about Filtronic’s capabilities within critical industries such as Aerospace, Defence, Telecommunications Infrastructure and Space, click here

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As increasing numbers of satellites are launched into low Earth orbit (LEO) to expand data connectivity around the world, there is an urgent need to improve the commercial viability of small satellite manufacture and deployment.

New opportunities in space

Recently, companies with big ambitions to connect the unconnected have embarked on large-scale programmes of LEO satellite launches to create massive constellations. To date, no standard specification has been developed for the transmitters, receivers, amplifiers and other components employed within LEO satellite payloads. These components need to withstand solar radiation, temperature extremes and other rigours of space orbit whilst operating effectively and reliably for several years. LEO components deployed to date have been developed by engineers on a case-by-case basis, sometimes using the more stringent specifications for geo-stationary satellites as a starting point. This has likely resulted in over specification (and over-pricing) of components for LEO satellites.

To make a sustainable business case for LEO satellite constellation deployment, the industry needs to find commercial-off-the-shelf (COTS) components that meet all the necessary quality and performance requirements, but which can be tested and volume manufactured at an affordable cost.

Proven performance and reliability

At Filtronic, we have been designing and manufacturing high-performance amplifiers and transceiver modules for demanding terrestrial applications for many years. These are widely deployed in mission-critical environments for the telecommunications, aerospace and defence, and emergency services sectors, as well as more recently in high-altitude pseudo-satellites (HAPS).

Our exhaustively tested sub-systems offer the proven reliability and performance needed for LEO applications. The compound semiconductor (core MMIC line-up) technology we use is inherently benign to radiation, making it compatible with space deployment. Other components, such as power supplies and micro-controllers, do feature silicon, which is susceptible to radiation. However, these components can be replaced with readily available radiation-tolerant alternatives, tested and up-screened to achieve compatibility with LEO applications and system quality goals.

Viability relies on volume

Crucially, to make the concept of COTS products a realistic option for LEO satellite applications, the components need to be efficiently volume manufactured – bringing the cost per unit down to commercially acceptable levels. That’s where Filtronic stands out in the market. Thanks to continued investments in state-of-the-art precision manufacturing facilities and automated processes, we are able to produce microelectronic sub-systems efficiently and competitively at scale. Even with high-volume throughput, we achieve very high yields through continuous improvement and lean manufacturing. That enables us to offer sustained cost reductions for clients requiring complex, high-mix sub-systems manufactured to extremely high reliability and quality levels. Such as those required for military modules and commercial mm-wave radios destined for many years of service in harsh environments.

Higher frequencies boost capacity

As satellite networks expand and more people worldwide are connected to the Internet via LEO satellite, the demand for data will increase exponentially – requiring a corresponding increase in bandwidth to boost capacity. Currently, LEO satellites employ Ku and Ka band payloads (~12-30GHz). Second generation mega-constellations will push up to Q and V bands (33-60GHz) where more bandwidth is available. To support these higher frequency bands, gateway links at E-band (71-76GHz / 81-86GHz) are being considered, because E-band provides the wide bandwidth pipe needed to support the increase in user terminal capacity. Furthermore, E-band has been identified as a candidate technology for inter-satellite links to enable mesh networking within constellations.

Our specialists at Filtronic have extensive experience in designing and manufacturing modules at high mmWave frequencies, including Q to E-band. Using variants of our transceiver modules for LEO applications will equip satellites and ground-based gateways with the capacity to meet rapidly growing demand for data as more people worldwide are brought online.

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You are a well-established electronics manufacturer with considerable production expertise, and you have a new contract for a big defence or telecoms project. The strategy at first glance appears simple—you design and manufacture, expanding your design team and factory to cope with the additional throughput. But is that really the best, or the only, option?

At Filtronic we have the capacity, experience and the expertise to design and manufacture high performance RF products at Microwave and mmWave. We are equally comfortable manufacturing to a customer’s design, as we are designing and manufacturing our own high-performance products. Alternatively, we love working with our clients, fusing their core competencies with ours to optimise their original design.

Designing and manufacturing everything in-house does not come without hidden costs. Increased design capabilities require recruitment or training costs, increasing manufacturing capacity requires significant investment in new capital equipment, as well as recruitment of new personnel and training. This takes time to ramp up to reach its full potential. New processes will need qualification, your IP will need to be protected, and you will need to manage a process of continuous improvement to minimise waste and optimise efficiency. With a substantial Bill of Materials cost combined with high manufacturing throughput, yield will have a direct effect on the bottom line.

Furthermore, there will almost certainly be financial liabilities written into the contract terms and conditions that would mean a penalty if deliveries were disrupted due to circumstances beyond your control. And in the era of COVID-19, does any manager feel entirely in control of their production line?

Then what becomes of the extra capacity when the contract ends? Do you take the difficult decision to lay off staff and dispose of excess capital assets? This could be avoided by outsourcing the manufacturing, which means that you only pay for the capacity when you need it, and at the end of the contract there will be no additional cost related to capacity reduction. Nevertheless, outsourcing the whole job to a contract manufacturer can bring its own problems. There could still be delays, and these can damage reputations however they are caused. So, delegating control for the entire production run may not feel the right option either.

Dual sourcing provides the answer. This strategy gives the advantage of increased flexibility and a reduced risk of disrupted schedules, as well as offering the opportunity to rapidly scale or shrink volumes without either incurring extra personnel and equipment costs or keeping a line running below capacity. The right choice of second sourcing partner can solve a lot of headaches. Working together means that best practice can be shared, and both partners can draw on their experience and the lessons they have learnt from past contracts for similar applications. Collaborating on applied continuous improvement offers real-time benefits in terms of reducing the cost per unit and maximising yields.

Dual sourcing has other well-documented benefits, among them the potential for faster lead times, scalability, and more consistent supply. There can also be advantages if a company with a broad product and technology base can draw on the specialised expertise of a contractor.

Partnering with Filtronic as a second source can help you meet the challenges of ramping up production without compromising on quality. With a recent investment of over £1 million in new assembly and test equipment, Filtronic has recently overseen a significant increase in the capacity of its Sedgefield manufacturing facility to a potential throughput of 10,000 transmit/receive modules (TRM) per month, with an average final yield of 95%.

Customers around the world trust Filtronic with the prototyping and manufacture of their own product designs, due to its first-class reputation for product quality and reliability. Working for a major global OEM, Filtronic has manufactured six different TRM variants amounting to a total of more than 60,000 modules in the last three years and has also received a special commendation from a European defence customer for its outstanding effort and commitment in delivering a volume TRM production run for an AESA radar system.

Filtronic fosters a strong quality culture, supported by Six Sigma, high levels of production automation, strict traceability, and with approvals to military standards. The skilled workforce has a wealth of experience, with the average length of service for assembly operators standing at 14 years.

Filtronic’s production capability provides full hybrid assembly including microwave and mmWave device packaging, including low-void die attach and precision component placement, fully automated wire and ribbon bonding with deep-access multi-level capability, hermetic sealing, and automated test up to 90GHz and above.

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Having invested over U.S. $1.3 million in new equipment at the end of last year, and at the same time expanded its workforce, Filtronic has recently overseen a significant increase in the capacity of its manufacturing facility in Sedgefield, in the North-East of England. The 20,000-square-foot design and manufacturing center produces Filtronic’s integrated E-Band transceiver modules in high volumes for mobile backhaul, products that are now seeing accelerating demand due to the roll-out of 5G globally. Over 500,000 transceiver modules and 700,000 filter products have been successfully deployed in the field. Of these, more than 40,000 have been E-band modules, including the company’s flagship Orpheus and Morpheus II transceivers.

Filtronic is also seeing a significant increase in demand for its custom design and microelectronics assembly services, particularly at microwave and mmWave frequencies. These services enable clients around the world to commission their own product designs to be prototyped and manufactured in an automated factory in the U.K., with a world-class reputation for product quality and reliability. The company’s expertise has been accumulated during a heritage spanning more than four decades since it was first founded in 1977. Filtronic fosters a culture with a commitment to quality supported by Six Sigma, high levels of production automation, strict traceability and adherence to military standards. The Filtronic team is highly qualified, experienced and enjoys enviable levels of retention with an average length of service of over 14 years. Filtronic’s aim is to provide a unique path to a low-risk, secure service to make products for applications including point-to-point radio links, phased array radars and security applications such as imaging.

The manufacturing and test area at Sedgefield includes 2,500 square feet of Class 100,000 clean rooms, and another 2,500 square feet of engineering development labs. Its production capability includes microwave and mmWave device packaging, sub-assembly manufacturing and test, specializing in mmWave projects up to 90 GHz and beyond. Filtronic also offers design services to fit customer’s needs. The company’s expertise is taking a project from concept to implementation. In all cases, from rapid prototyping to volume production, the appropriate design expertise and production engineering advice is readily available.

Filtronic’s hybrid microelectronics assembly and test portfolio includes low-void die attach and precision component placement; fully automated wire and ribbon bonding with deep-access multi-level capability; skilled manual assembly; hermetic sealing; and automated test to 90 GHz. Proprietary air cavity packages can include mixed GaAs, GaN and Si die within a single package, and can perform at frequencies higher than 90 GHz. Particular attention is given to optimizing die attachment and heatsinking for power devices, and in minimizing wire-bond parasitics for products that operate at higher frequencies. The precision hybrid microelectronics assembly facility has received significant positive feedback from its clients, including a major European defense manufacturer who singled out Filtronic’s manufacturing expertise for a special commendation. The award cites Filtronic’s effort and commitment in successfully delivering a large production run of transmit/receive modules as providing an “outstanding contribution” to its state-of-the-art radar system.

Reproduced courtesy of https://www.microwavejournal.com/ original version can be found here

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E-band is well established as an attractive and cost effective, high capacity solution for mmWave XHaul applications, capable of supporting radio links up to 20Gbps. The spectrum allocations available in E-band are 71 – 76GHz and 81 – 86GHz. However, the ever-increasing demand for data means that still higher capacity is going to be required in 5G XHaul networks, and the need for links up to 100Gbps has already been identified. Moving up the frequency spectrum to W-band and D-band systems, where huge amounts of further bandwidth become available, will likely prove to be part of the solution.

Higher order modulation techniques can also increase data rates, but these demand higher signal-to-noise ratios and very linear components in order to keep error rate to a minimum. Multi-channel systems like XPIC (cross-polarization interference cancelling) and line-of-sight MIMO have also been demonstrated to provide enhanced data rates, but require more expensive radio equipment.

Higher bands

W-band refers to the range of the radio frequency from 92GHz to 114.5GHz, and D-band normally refers to frequencies in the range 130 – 175GHz, as shown in Figure 1. The atmospheric attenuation in W-band is very similar to that in E-band, while the rain attenuation in D-band is only around 2dB higher and is almost flat across the frequency range.[i]

An antenna of the same size will also give a higher gain in D-band compared to one at a lower frequency. All these features make the D-band system a good candidate for the next generation ultra-high capacity wireless links. System simulations carried out by the ETSI mWT ISG (GR mWT 008) suggest that link distances of several hundred metres are practical at D-Band frequencies with antenna sizes comparable to those at E-Band.[ii]

In 2018, the European CEPT Electronic Communications Committee (ECC) issued recommendation 18(01) identifying sub-bands totalling more than 30GHz over the following frequencies, for potential use at D-band for fixed service backhaul and fronthaul: 130 – 134GHz, 141 – 148.5GHz, 151.5 – 164GHz and 167 – 174.8GHz.[iii] These bands, and the bandwidth each makes available, are summarised in Figure 2. This CEPT recommendation generated a significant level of interest in developing the D-band component technologies that will be required to produce such links in the future.

In terms of the semiconductor technologies for use in D-band,  the proposed bands can be supported with III-V MMIC technology. 100nm InGaAs mHEMT devices can be used for power amplifiers (PA) up to 155GHz, and InP pHEMT devices on a 100nm process can be used for PAs up to 170GHz. InP DHBT processes with fMAX greater than 650GHz are emerging which are showing promising performance across the whole of D Band.  For low-noise amplifiers (LNA), devices on both 35nm InP pHEMT and 50nm InGaAs mHEMT processes can perform up to 185GHz and beyond.

Silicon-based technologies   have demonstrated  PAs  and LNAs operating up to 160GHz in the case of SiGe and 140GHz in the case of SOI-CMOS. SiGe technology continues to develop and specialist foundries are offering processes with Fmax > 400GHz.  All of these devices would be custom, however, as no standard commercial devices are currently available in these frequency bands.

Collaborative project

An Innovate UK-funded project[iv] was carried out to build upon previous research work on D-band components, and to develop methods for integrating them into a transmit-receive module for use in high speed links. In particular, it concentrated on developing a robust method for making low loss connections between the active circuits in the module and to the external interface, which is generally a waveguide port connected to an external antenna. Filtronic and the UK’s NPL (National Physical Laboratory) collaborated on the project, which concluded successfully in January 2019. Filtronic explored designs and assembly techniques to provide low loss D-band transitions between mmWave integrated circuits (MMIC) and various external circuits – these designs were successfully fabricated and demonstrated. New methods of on-wafer calibration and measurement were developed collaboratively by NPL and Filtronic, and these were described in detail in a presentation by Xiaobang Shang of NPL at the ARMMS RF and Microwave Society meeting in November 2019[v]. Figure 3 shows the test setup used by NPL for these measurements.

The work included trials of hot via technology. This is where via holes that connect between the top surface of the IC and pads on the backside of the IC are bonded directly to the tracks on the circuit board. This technique eliminates excess bond wire inductance, and allows surface mounting of MMICs.

Ongoing work

Filtronic continues to cooperate with NPL on D-band measurements, and NPL was recently awarded a grant from EURAMET for “Knowledge Transfer of Planar Calibration and Measurement Techniques at Millimetre-wave Frequencies”. Filtronic is the primary industry supporter for this project.

Filtronic is also an Industrial Partner within the UK EPSRC “DLINK” project, led by Lancaster University and the University of Glasgow, established to explore use cases within D Band.[vi]

by Dan Rhodes and Mike Geen, Filtronic

This editorial was orginally posted on Everything RF

[i] https://www.etsi.org/deliver/etsi_gr/mWT/001_099/008/01.01.01_60/gr_mWT008v010101p.pdf

[ii] https://www.etsi.org/deliver/etsi_gr/mWT/001_099/012/01.01.01_60/gr_mWT012v010101p.pdf

[iii] https://docdb.cept.org/document/2012

[iv] https://www.gov.uk/government/publications/innovate-uk-funded-projects, Project Reference 103438

[v] https://youtu.be/JdkN3iHeAIY

[vi] https://gow.epsrc.ukri.org/NGBOViewGrant.aspx?GrantRef=EP/S009620/1

PR contact:

Helen Duncan, MWE Media Ltd
Tel: +44 (0)7765 250610
Email: helen.duncan@mwemedia.com

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MIKE GEEN – Chief Scientist – Filtronic

The challenges of implementing 5G radio access have been widely discussed, and one of 5G’s most pressing areas of
need is the technology connecting the network to the core. As the first 5G networks are rolling out, network architects
are seeking the highest capacities and data speeds possible for backhaul, in a format that can be rapidly and flexibly
deployed wherever it is needed.

The backhaul segment of the network is traditionally made up of the intermediate point-to-point links between the
core (or backbone) network and the small subnetworks at the network edge, where the base stations are. Since 5G is
aiming for multi-Gbps data rates for subscribers, all this data will need to be backhauled at much higher rates, too.

In addition to the evolution of the air interface, the radio access network (RAN) is itself evolving, with its functions
being ‘decomposed’ into a number of different locations. In 4G LTE, distributed RAN (D-RAN) and cloud (or centralised)
RAN (C-RAN), respectively, have allowed a remote or centralised baseband unit (BBU) to be used, connected to the
remote radio unit (RRU) via an eCPRI ‘fronthaul’ interface.

In 5G, the BBU will further be split into a distributed unit (DU) and one or more central units (CU), and these will be
connected using a ‘mid-haul’ link. Collectively, all these types of link are known as X-haul. More details may be found
in a new report published by ETSI’s millimeter Wave Transmission Industry Specification Group (mWT ISG), GR mWT
012.

Now more than ever, a wireless solution — rather than fibre — will be the obvious choice for X-haul. Already in Europe,
around 50 percent of backhaul between the edge and the core network is wireless. In some countries, including India,
the proportion is greater1. With the higher densities of small cells necessary to implement 5G, this share is set to
increase rapidly.

Wireless backhaul is quicker and simpler to deploy than fibre, and it is more cost-effective. Laying new fibre typically
costs between $35,000 and $100,000 per kilometer2,3, whereas the cost for a wireless link is an order of magnitude
lower2. Furthermore, in a complex urban environment, it can often be impossible to lay new fibre exactly where it is
needed.

The traditional bands for wireless backhaul between 6 GHz and 42 GHz served well for 3G and 4G. However, they
would struggle to meet the needs of 5G, where the dual requirements of higher data rates and increased capacity
mean much higher bandwidth requirements.

One way to achieve the additional bandwidth required is to move higher up the spectrum into mmWave bands —
particularly effective in urban environments, where link distances are relatively short. In the existing bands, there exist
a number of narrow channels; the total bandwidth available for mobile backhaul below 42 GHz is just 15 GHz. This
bandwidth is heavily used, and expensive licences are required to operate within it.

In contrast, the mmWave bands above 50 GHz will provide over 20 GHz of additional bandwidth in large chunks,
allowing very high data rates to be achieved. Some of the traditional wireless bands — notably, 26 GHz and 28 GHz —
have an uncertain future for backhaul, since they are now being targeted for 5G radio access.

ETSI’s mWT ISG already has expressed its concern regarding the need, when allocating mmWave bands for 5G, to
consider the ability of operators to continue operating backhaul for their 3G and 4G networks, as well.

The main mmWave bands for telecom transport are V-Band (57 – 71 GHz) and E-Band (71 – 86 GHz). There is even
some interest for the future in W-Band (92 – 114.25 GHz) and D-Band (130 – 174.8 GHz) but working at such high
frequencies introduces additional technical and manufacturing challenges.

In 2015, just 0.2 percent of fixed wireless links were at V-Band and less than 2 percent were at E-Band4. E-Band,
however, is increasing its share very rapidly — by 2018 E-Band accounted for around 7 percent of links and, as it is now
accepted as an essential element in 5G transport networks, this trend is forecast to continue with year on year growth
rates of around 36 percent, according to Dell’Oro Group5.

The licensing situation for V-Band has restricted its development. Although V-Band may seem attractive because it is
licence-free in many countries, operator concerns over interference and availability have hampered its application for
mobile backhaul.

V-Band is, however, finding a place in multipoint-to-multipoint meshed networks in dense urban scenarios, where each
network element, with beam-steerable antenna, could be reached by more than one direction by other equipment. This is helped by the extension of the licence-free band to 71 GHz, which provides more bandwidth and better propagation characteristics.

At higher frequencies, it also becomes necessary to take atmospheric attenuation into consideration. There are
well-characterised bands where absorption by water and oxygen molecules can be a problem, and rain attenuation
increases rapidly with frequency up to around 70 GHz, after which it begins to flatten out. Nevertheless, system
simulations carried out by the ETSI mWT ISG (GR mWT 008) suggest that link distances of several hundred metres are
practical at D-Band frequencies with antenna sizes comparable to those at E-Band.

Broader contiguous bandwidth allocations are not the whole story. Capacity and throughput can also be increased by
techniques such as network topology changes (densification, RAN sharing, increased fibre penetration from the core
to the edge); shorter link distances utilising star topologies from the fibre aggregation point, and; increasing channel
width in the traditional bands by the use of carrier aggregation.

Combining carrier bandwidth from different parts of the spectrum not only offers an increase in the total available
bandwidth, it can ensure availability where one band has superior propagation characteristics, allowing longer links.
Several aggregation scenarios are now either being deployed or being proposed for future deployment: two or more of the traditional microwave and sub-6 GHz bands, offering 1 – 5 Gbps; a microwave band (15 GHz, 18 GHz or 23 GHz) plus E-Band, providing up to 10 Gbps; and, in the future, E-Band plus D-Band can provide up to 100 Gbps.

Higher order modulation techniques can also increase data rates, but these demand higher signal-to-noise ratios and
very linear components in order to keep error rate to a minimum. Multi-channel systems like XPIC (cross-polarization
interference cancelling) and line-of-sight MIMO have also been demonstrated to provide enhanced data rates, but
require more expensive radio equipment.

In considering all these factors, we believe that wide-bandwidth mmWave radios provide the optimum solution to
meet the increasing capacity demands for backhaul and other types of transport in next-generation communications
system. mmWave links currently have the ability to give fibre-like capacity — up to 40 Gbps in multichannel
configurations — and, with carrier aggregation, can operate at high capacity up to 10km.

Further, new spectrum allocations above 95 GHz will provide a path to even higher capacities in the future.

References

1. Ericsson Microwave Outlook 2018: https://www.ericsson.com/en/microwave-outlook/reports/2018
2. “Backhauling with fibre?”, Fibre Systems, Winter 2015: https://www.corning.com/media/worldwide/coc/
   documents/Fiber/FSwin15pp3334.pdf
3. GSMA Mobile Backhaul: An Overview, June 19, 2019: https://www.gsma.com/futurenetworks/wiki/mobilebackhaul-an-overview/
4. SkyLight Research 2015
5. Dell’Oro Group Press Release, 23 July 2019: https://www.delloro.com/news/17-billion-of-microwave-transmissionequipment-needed-over-five-years/

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