by Dan Rhodes, Director of Business Development, Filtronic

For years, expertise in terrestrial applications has served as a launchpad for innovation. Companies honed their skills by building the networks that connected us on earth, but now, eyes are turning skyward. By adapting their capabilities to the unique demands of non-terrestrial applications, these same players are unlocking new possibilities and rewriting the rules of communication beyond the atmosphere. Here, Dan Rhodes, Director of Business Development at designer and manufacturer of RF-to-mmWave components and subsystems, Filtronic, explores the bridge between terrestrial expertise and non-terrestrial ambitions, highlighting how terrestrial success is becoming the fuel for stellar solutions.

Bridging the terrestrial and non-terrestrial wireless communications worlds is not merely a matter of applying existing technologies to a new canvas. While both environments share fundamental principles of physics, plus they rely on robust components such as transmitters, receivers, filters and amplifiers, the shift upwards introduces a unique set of challenges and demands.

On Earth, networks operate within the relatively familiar confines of our atmosphere, where distance limitations are measured in kilometres and power requirements are readily met. But as we venture beyond the horizon, the equation changes dramatically.

In space, communication distances balloon into hundreds or thousands of kilometres, necessitating solutions that can punch through the void with greater power whilst also remaining energy efficient. Platforms like satellites and balloons become new transmission towers, imposing tight weight and size constraints on the equipment they carry. And the harsh reality of space adds an extra layer of complexity, with components needing to withstand the unforgiving onslaught of radiation and extreme cold in a vacuum. These factors demand a nuanced approach, where terrestrial expertise is not simply transplanted, but adapted and refined to meet the specific needs of the non-terrestrial realm.

Unifying principles

The transition from terrestrial to non-terrestrial isn’t a leap into the unknown — it’s more akin to scaling a familiar mountain from a different angle. Both terrestrial and non-terrestrial components share a reliance on similar robust and precise manufacturing techniques, factors that play a crucial role in ensuring quality across different application environments. The core principles of component and sub-system construction — precision assembly, rigorous material selection and adherence to quality control processes — remain consistent, ensuring robust performance regardless of whether the component is used in a tower, the stratosphere or in low Earth orbit.

Similarly, the performance objectives that drive terrestrial design translate into the non-terrestrial realm. Goals such as maximising signal fidelity and minimising power consumption become increasingly critical when dealing with the unique challenges of space, especially when ensuring uninterrupted and dependable data transfer and maintaining communication integrity over vast distances.

Distinctive challenges

In the non-terrestrial domain, the weight of components becomes critically important. Satellites, high-altitude balloons and fixed wing platforms — which must contend with the formidable constraints of gravity — require components that strike a delicate balance between power and minimal weight.

This imperative for lightweight, yet powerful, components has spurred significant innovation in materials science and engineering. For example, advanced composites and alloys are increasingly employed to reduce weight without compromising structural integrity or performance. Engineers also focus on optimising the design of these components to ensure they consume less power. The power efficiency not only reduces the size and weight of the power supply units, but also extends the operational lifespan of the satellites and balloons.

The move to miniaturisation is key here, where the goal is to compress the capabilities of conventional equipment into increasingly compact forms. This involves leveraging advanced materials, designing sophisticated heat dissipation mechanisms and employing innovative packaging techniques — all of which are essential in creating components that are both lightweight and highly functional.

Additionally, space presents a challenge not faced by its terrestrial counterpart — radiation. To safeguard against space radiation, engineers employ a multi-layered defence strategy that goes beyond traditional protection methods. This includes the use of specialised shielding materials designed to absorb or deflect high-energy particles. Such materials are often lightweight yet robust, tailored to add minimal weight while providing maximum protection.

Strategic partnerships

For design engineers venturing into the non-terrestrial domain, it is important to partner with a company that not only understands the importance of extensive, rigorous testing and qualification but also possesses the capability for repeatable mass production of quality components. Rigorous device selection and qualification testing ensures that every component can withstand extreme conditions, including intense radiation, extreme temperatures and the vacuum of space.

This level of testing is vital for predicting and enhancing the longevity and reliability of the components in orbit. Furthermore, a company adept in mass-producing these specialised components can offer significant cost advantages. Mass production allows for economies of scale, reducing the per-unit cost of components. This efficiency is particularly crucial in the space industry, where going forwards project budgets can be tight in order for business cases to make commercial sense.

Bridging the gap isn’t just about replicating terrestrial solutions; it’s about adapting them with ingenuity and precision. From maximising signal fidelity across vast distances to mitigating the harsh realities of space radiation, these adaptations push the boundaries of communication while leveraging the bedrock of terrestrial know-how. As the industry continues to evolve, strategic partnerships and a focus on efficient production will be crucial for cost-effective, reliable communication, beyond the stratosphere.

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by Tudor Williams, Director of Technology, Filtronic

The world of RF (Radio Frequency) and mmWave (millimetre-wave) communications is rapidly advancing toward harnessing the potential of ultra-high frequencies, reaching 300 GHz and beyond. This journey, while filled with promise, is laden with challenges. Here, Tudor Williams, Director of Technology at designer and manufacturer of RF-to-mmWave components and subsystems, Filtronic, explores the considerations involved in designing and manufacturing at 300 GHz, delving into the difficulties, evolving technologies and the need for innovation to make this a reality.

The Internet has become an integral part of our daily lives, facilitating activities such as information exchange, social networking, banking and online shopping. As we step further into the era of the Internet of Things (IoT) — where a web of smart devices seamlessly connects — the possibilities are endless. These IoT applications are poised to reshape everything from the way that our households run to modern businesses and manufacturers.

To meet these needs and keep up with the ever-increasing demand for data, 5G and 6G wireless networks must push the boundaries further, the most likely early implementations of these higher frequency bands will be in Backhaul (effectively the data-pipe between the base-station and the core network simultaneously serving the data needs of all network users.

“Although mmWave and E-band (71GHz to 86GHz) have delivered major leaps forward with data rates in excess of 10Gbps, it is what comes next that is now capturing people’s attention and creating the biggest challenges. In the following article, we will explore some of these challenges in greater detail.”

Manufacturing challenges and tolerances

Manufacturing tolerances stand out as a significant hurdle when dealing with high-frequency designs. As frequency rises, the demands for tighter tolerances on component placement, interconnects and metalwork increase. Traditional manufacturing methods, such as CNC machining used to create the waveguide for signal conditioning, might lack the precision. This forces the adoption of new production methods such as additive manufacturing to achieve the required tolerances.

Moreover, the journey from lower frequencies to 300 GHz involves the development of smaller semiconductor features, especially for high-power devices. For compound semiconductor devices, this progress is slower due to limited demand and increased complexity. The development of these processes is driven by the emergence of new applications and business cases, making it a lengthy and costly journey.

Integration and packaging challenges

One of the paramount challenges in high-frequency design is the management of parasitics. A good example would be wire bonding at lower frequencies. The impact of parasitic elements can be mitigated with relative ease, but as we move to mmWave frequencies it becomes necessary to design a matching network to cancel out the parasitic effects. When we move to 300GHz this becomes impractical as manufacturing tolerances mean that a different matching network would be required for each new bond — clearly impossible in a volume production environment.

To overcome these challenges, a shift towards alternative packaging and interconnect solutions for semiconductor devices becomes imperative — work has already started on such designs including flip-chip, hot vias and chip scale packaging.

Semiconductors

At these high frequencies, semiconductors become a critical focal point in the overall design. Each semiconductor material has unique properties which can support the critical design requirements. At lower frequencies, a mix of performance and cost often leads to the integration of several individual semiconductors, whereas for higher frequencies the aim will be to integrate as much of the functionality as possible into a single chip, to minimise interconnects and the related problems outlined above.

It is therefore likely that much of the integration will be in the form of a silicon chip with the high-performance elements, such as the power amplifier and LNA, having to remain in a compound semiconductor material to maintain the required performance. As it stands today, the processes do not exist with the performance to meet the power required to form wireless data links, but these will evolve in the coming years.

Thermal management challenges

With each stride toward higher frequencies, the efficiency of electronic devices experiences a noticeable decline. This means that more DC power is required to achieve the same RF output power. This clearly calls for larger power supplies, but more critically, leads to the dissipation of more power in the form of heat.

Compounding this challenge is the continual miniaturisation of electronic circuits. As components and devices become smaller and more densely packaged, the heat generated is concentrated within a reduced physical area. This concentration of heat amplifies the importance of effective thermal management. Failing to adequately dissipate this heat can lead to various issues, including reduced device performance, reduced lifetime and even device failure.

To address these thermal management challenges, the industry is actively exploring innovative solutions. This starts at the critical interface between the semiconductor device and the heatsink, leading to a requirement for innovative materials in epoxies, sinters and solders to remove heat from the device while maintaining an expansion coefficient with the other materials around it to remove stresses and strains, which can again lead to device aging or failure.

Once the interface is controlled, heat must be quickly spread. Here, heat-spreaders are deployed with materials such as copper, molybdenum and even diamond, used for its enhanced thermal properties. Once the heat is spread it must be effectively removed leading to requirements for forced air convection or liquid cooling.

Manufacturing constraints

Manufacturing at high frequencies introduces a whole new realm of intricacies. Precision becomes the bedrock of this endeavour, with an unyielding demand for tight tolerances in critical areas such as component placement and epoxy dispensing. The high-frequency landscape leaves little room for error, and even minuscule variations in component placement can result in severe consequences. The challenge, therefore, lies in the development of machinery capable of producing high volumes with impeccable precision.

The pursuit of precision in manufacturing for high frequencies often necessitates the creation of custom machinery. Off-the-shelf solutions may prove inadequate when dealing with the exacting requirements of these designs. As a result, manufacturers are driven to invest in tailor-made, precision-focused equipment that can meet the stringent demands of high-frequency production. This tailored approach, while addressing the need for precision, adds an additional layer of complexity to the manufacturing process.

In essence, the challenge in high-frequency manufacturing extends beyond the design and engineering phases. It’s not just about creating high-frequency designs but making them viable for mass production. The intersection of precision, custom machinery, and evolving manufacturing techniques creates a nexus of complexity and opportunity. As the industry strives to lead the way in RF and mmWave communications, it must navigate these manufacturing constraints with ingenuity and unwavering commitment to achieving the desired precision in high-frequency electronic systems.

In the high-frequency landscape, it’s not merely a journey of technological progress; it’s a relentless pursuit of precision; precision in design, manufacturing, and achieving the desired performance at these as-yet-unreachable frequencies. Although designing solutions to 300GHz is possible, achieving production at scale for such high frequencies is still an elusive goal — it’s not today’s technology, but a vision for the future.

• RF Solutions for Public Safety Critical Communications
• Aerospace and defence applications
• Telecommunications
• RF Solutions for Space
• RF Testing and Measurement

The post Designing for the future appeared first on Filtronic.

by Dan Rhodes, Director of Business Development, Filtronic

In 2021, mobile network operator EE launched a TV advert showing actor Tom Ellis being shaved by a robotic arm that was being remote-controlled by a barber based 250 miles away — a stunt only possible with low latency and high-speed data transfer capabilities. Here, Dan Rhodes, director of business development at critical communication equipment provider Filtronic, discusses how 5G deployment made possible through critical telecom infrastructure such as XHaul enables the bandwidth and low latency to make this stunt a reality.

The benefits of 5G are transforming the components of traditional telecommunication network infrastructure. Its ultra-fast and low-latency connectivity and potential to deliver data speeds back into the network of > 10Gbps, coupled with the ability to support thousands of clients per cell, puts 5G ahead of current mobile infrastructure — if it delivers to its full potential.

E-band has been a key enabler of XHaul and the transition towards 5G. But it has taken over 10 years to get to this point. Like all new frequency bands, E-band had to overcome cost, availability, and capacity issues to fulfil increased demand. The construct was simple; most cell sites were equipped with backhaul links running at one Gbps or less. Now, the rollout of 5G and its capabilities in both fronthaul and midhaul means that there are two new, distinct XHaul concerns: the necessity for extremely dense networks and addressing the low latency needs of increasingly complex applications.

Backhaul networks may be less impacted by latency specifications than fronthaul and midhaul networks, but backhaul capacity pressure is a significant concern. Backhaul capacity needs for 5G (10-40Gbps) and 6G (target 100Gbps) dwarf existing 4G networks.

While the full implementation of 5G will continue to favour fibre, it won’t be a feasible choice in many areas. Microwave technology is a fast and economical method for connecting isolated or small groups of locations to the main fibre network. The conventional microwave frequency range of 6-42 GHz is facing limitations in expansion due to congestion, interference, and re-use of some bands for RAN, thus leading to a shift towards millimeter-wave (mmWave), specifically  E-Band (71-76GHz / 81-86GHz), the only commercially viable mmWave band at this time.

The E-Band market is projected to grow rapidly worldwide, with a market report predicting a 35.8 per cent CAGR by 2027. E-Band is favoured by operators due to its large channel size and readily accessible spectrum, with over 80 per cent of countries with known telecommunication regulations allowing E-Band deployment. This means that demand has increased for E-Band mmWave radio links due to their ability to provide high capacity and high data rate XHaul for the latest 5G networks that are being rolled out globally.

The E-Band frequency spectrum offers both technical and economic benefits over the lower 6-42 GHz spectrum. Millimeter-wave wireless systems make use of a larger assigned spectrum divided into larger channels, which enables the delivery of multi-gigabit data rates. In comparison, the largest assigned channel in the 6-42 GHz spectrum is 56 MHz, while the smallest typical channel size in the E-Band is 250 MHz and can go up to 2GHz for wireless backhaul.

 With the use of a large allocated spectrum and channels, E-Band wireless systems are more robust and reduce modem and radio requirements, resulting in significant cost advantages over traditional wireless systems. This allows for scaling up to gigabit-per-second capacities without the need for additional radio equipment or licensing fees.

Although it is susceptible to rain attenuation, the sturdy design of E-Band wireless systems and higher antenna gains make it possible to deliver high capacities with a carrier-grade service availability of 99.999 per cent for distances up to three kilometres (km). In urban areas, where the distances between mobile base stations are typically short (averaging 1.5km for urban and 2.5km for suburban), E-Band wireless systems are well-suited for ultra-high XHaul capacities. It’s also worth noting that these urban and suburban areas account for around 80-90 per cent of the elements in a network that require a XHaul solution.

Transceivers that sit in point-to-point radios, like Filtronic’s latest generation Morpheus X2 modules, offer high performance and ultra-high capacity while also lowering the overall cost per Gbps. Each module contains all the transmit and receive functions necessary for the RF section of an E-Band link and provides a simple drop-in connectivity between a high data rate full duplex modem and an antenna.

There are installations where the distance between stations needs to be larger. This could affect commercial viability —for example, implementing larger antennas to boost range has an impact on both material and operational costs. This is where the choice of components used becomes even more important. Higher-power transceivers, like the Morpheus X2, are being used to ensure performance across twelve kilometres of range, without compromising on size or weight.

The demand for data is constantly rising with no signs of slowing down, now or in the future. As mentioned earlier, with 80 per cent of countries allowing E-Band deployment and with more 5G networks being rolled out, it is inevitable that this frequency range will become congested. As E-Band becomes congested, alternative bands with similar or even higher bandwidths available will be required to ensure that XHaul capacity can keep pace with increasing data demands. These bands will be W-band (92-114GHz) and D-band (130-175GHz).

Filtronic has been involved in a collaborative project with the UK National Physical Laboratory (NPL) on next-generation mmWave technology for W-Band and D-Band systems up to 175GHz – to enable emerging 5G wireless XHaul requirements up to 100Gbps.

Moving up the frequency spectrum from E-Band to W-Band and D-Band systems, where huge amounts of further bandwidth are available, is seen as part of the solution to increasing data capacity to meet global demand. But until then, network operators must size appropriately the Xhaul network to cope with the massive amount of data and opportunities generated by 5G using mmWave technology, now and in the future.

• RF Solutions for Public Safety Critical Communications
• Aerospace and defence applications
• Telecommunications
• RF Solutions for Space
• RF Testing and Measurement

The post A close shave: 5G to the rescue appeared first on Filtronic.

In the ever-evolving landscape of technology and industry, one finite resource remains the unsung hero in enabling our modern way of life – the radio frequency (RF) spectrum. Here Tudor Williams, Director of Technology at Filtronic, explores how demand for wireless broadband access has highlighted the limitations of this essential resource.

The explosive growth of wireless broadband is poised to reshape our world. With more than one billion 5G subscriptions anticipated by the end of 2022, skyrocketing to a forecasted 4.4 billion by 2027, the implications are far-reaching. Entire industries rely on fast and reliable mobile broadband access – and new industries will open up and expand when high-speed and low latency access becomes widely available. Tasks such as remote surgical procedures performed by surgeons worldwide will become reality, emerging technologies like driverless cars will be ever-present and all require uninterrupted, rapid data transfers.

While the world focuses on dwindling natural resources, the RF spectrum quietly fuels the functioning of virtually every aspect of society and industry through radio waves at microwave and millimetre wave frequencies.

However, the crux of the matter is the limited availability of the RF spectrum for these crucial applications. This precious resource is becoming increasingly scarce, and existing licensed frequency bands are becoming congested. The existing bands can be optimised further through innovative techniques like dual polarisation, higher-order modulation, and MIMO (Multiple Input, Multiple Output). However, these solutions have their limitations, especially as we move into higher-frequency ranges.

To ensure the RF spectrum’s ability to support our data-intensive future, the industry is investigating various approaches. These include optimising the use of current licensed bands through enhanced filtering, encoding, and separation techniques, although these improvements yield diminishing results. Another avenue involves using unlicensed frequencies, although this presents challenges related to competition and reliability due to the lack of regulation. However, the most significant solution lies in the exploration of higher millimetre wave bands (above 86GHz), where expansive and uninterrupted bandwidth offers a groundbreaking capacity boost.

While transitioning to higher frequency bands offers a promising solution, it brings along its own set of challenges. Atmospheric absorption increases, attenuating signals and reducing transmission distances. Additionally, manufacturing sub-systems for higher frequency bands becomes intricate due to tighter tolerances and smaller geometries. Availability of suitable semiconductors at these frequencies and power generation also remain critical hurdles.

In this pursuit of optimising the RF spectrum, collaboration between technology specialists and innovators becomes paramount. For companies pushing the boundaries of RF technology, these challenges are opportunities. By harnessing compound semiconductor processes like gallium arsenide (GaAs) and gallium nitride (GaN), companies can pave the way for higher-frequency communications. These advancements, combined with standard-setting by global industrial nations, could be the cornerstone of an efficient and uncongested RF communication network.

As we hurtle toward 6G and beyond, the quest for more efficient and reliable data communications becomes non-negotiable. Industry players like Filtronic are at the forefront, pioneering advancements in semiconductor processes and packaging techniques to enable the transition into higher frequency bands. As we collectively address these challenges, our ability to provide high-speed, low-latency communication solutions for applications across industries grows stronger.The RF spectrum plays a pivotal role in our interconnected world. While challenges loom, they’re surmountable through collaboration, innovation, and strategic advancements. The journey toward higher frequency bands is one that holds promise, offering the potential to revolutionise everything from healthcare to transportation. So, whether you’re in the telecoms industry, defence, aerospace, or any field touched by RF communications, the future is bright — driven by the determination to maximise this finite resource and meet global data demands head-on.

Find out more about Filtronic’s capabilities:

• RF Solutions for Public Safety Critical Communications
• Aerospace and defence applications
• Telecommunications
• RF Solutions for Space
• RF Testing and Measurement

The post The RF spectrum is not infinite – Ensuring RF spectrum sustainability amidst soaring demand appeared first on Filtronic.

Not all OSAT providers are the same

Many semiconductor suppliers and electronics companies work with outsourced semiconductor assembly and testing (OSAT) partners to manufacture specialist devices for specific industries. But not all OSAT companies are the same. When you need to provide control and monitoring devices for the most challenging high-temperature applications, you need to choose an OSAT partner that can consistently deliver high-reliability hybrid products for the harshest environments.

Some of these challenging applications include control and power modules located close to engines in aircraft, or sensors used in the oil and gas sector to monitor drilling operations. In all of these applications, high reliability is the primary requirement. Not every OSAT provider can deliver the hermetic hybrid electronic products required for such high-performance applications.

High-temperature applications demand a different approach 

Standard hybrid assemblies for applications below 150°C have been manufactured for many years using well-understood material sets. For temperature ranges above 150°C, however, specialist expertise is required to achieve the performance and reliability levels required.

It’s important to recognise that high reliability at high temperatures is linked to the way products are processed, not just their design. Specialist high-reliability OSAT partners take designs and schematics provided by clients – which are generally based on PCBs – and reconfigure them to create compact hybrid solutions with form, fit and function, designed for high-reliability, long-life performance.

So what differentiates an OSAT provider capable of delivering high-reliability hybrid electronics from a standard OSAT company?

– Materials selection

A key factor in achieving high reliability is the selection of materials. Most standard hybrid modules are built using epoxies as an adhesive for the components. However, the resins used in epoxies decompose with temperature and time, leading to outgassing from the module and ultimately the corrosion and mechanical breakdown of the electronics within.

To overcome this problem in higher temperature applications, material sets need to be selected for low outgassing, high structural strength and greater control of intermetallic interactions. This means choosing metal layers for the substrate that match the components and material you’re adhering to.

– Component selection

Alongside material selection, selecting the right components is the next critical step to ensure maximum product life. It’s important to avoid mismatches in coefficients of thermal expansion (CTE) between the joining materials and the selected components. CTE mismatches are the primary cause of most electronic failures within modules. To mitigate these stresses, specialist knowledge is required to select the appropriate joining materials.

– Precision manufacturing

Achieving extremely high reliability also requires precision manufacturing in a controlled environment. Order quantities for these complex modules tend to be small, but the costs are relatively high. To maximise accuracy and consistency in every module, component placement needs to be extremely precise. OSAT partners capable of manufacturing hybrid electronics for high-temperature applications will use fully automated dispense and component placement machinery, and implement rigorous visual and manufacturing processes.

Producing robust hermetic hybrid electronics means working beyond the current military standards. Manufacturing and testing components to perform at high temperatures means effectively working to bespoke standards, enabling products to be tailored to perform reliably in the most challenging conditions.

– Test

Depending on the functionality of the hybrid module some level of expertise and engineering capability is required to develop, maintain, and deliver robust end-of-line product test. The OSAT supply of optical modules, power modules or high-frequency RF hybrids requires a high level of subject matter expertise and access to state-of-the-art test equipment. Choosing a supplier with a strong track record in the technology is vital for a full turnkey OSAT solution.

– Traceability and accountability

Filtronic leverages its in-house Manufacturing Execution System (MES) software to track every aspect of the manufacturing process including materials, components, and labour.  Filtronic’s cloud-based software provides real-time data capture and analysis of multiple indicators at each step in the manufacturing process. Filtronic tracks production efficiency and other valuable KPIs. The MES also enables tracking of individual components or assemblies using bar codes which triggers the next station to prepare for assembly downstream. Filtronic’s MES is an essential tool for our production planners to identify where each unit or lot is within the manufacturing cycle, what materials are needed, and when.

Hybrid electronics for extreme applications

Very few OSAT providers have the in-house knowledge and experience to design, manufacture and test high-reliability electronics to such exacting standards. At Filtronic, we specialise in developing bespoke and customised electronics for specific clients and applications.

We have a track record of delivering reliable, high-performance components for the aerospace, defence and space sectors. That means we have the process knowledge, materials expertise and manufacturing capabilities to deliver high-reliability components with the necessary properties to perform consistently in extreme environments.

If you are looking for an OSAT partner for a challenging application like Oil & Gas or Aerospace, or if you are looking for a market leading RF OSAT partner, contact the specialists at Filtronic who can offer the expertise and advice you need.

Find out more about Filtronic’s capabilities:

• RF Solutions for Public Safety Critical Communications
• Aerospace and defence applications
• Telecommunications
• RF Solutions for Space
• RF Testing and Measurement

The post How do OSAT providers produce high-reliability electronics for extreme temperature applications? appeared first on Filtronic.

Outsourced semiconductor assembly and testing (OSAT) companies provide specialist manufacturing capabilities for semiconductor suppliers serving specific industries. Outsourcing your manufacturing and testing to a specialist provider can enable you to manufacture more complex devices, optimise costs and efficiencies, access niche expertise, reduce production time, increase output and allow you to focus on your core specialisms.

The relationship you develop with your OSAT partner is critical to your success in delivering the complex semiconductor assemblies required by your clients. When you are providing hybrid electronic products for extremely challenging high-temperature applications, such as those in oil and gas or aerospace environments, choosing the right OSAT partner can be key to delivering the innovative, high-reliability control and monitoring equipment your clients demand. This is not a traditional Contract Manufacturing Service or a build-to-print activity, it involves a much more integrated partnership-led approach.

There are a number of attributes, skills and capabilities to look out for when choosing an OSAT partner to deliver complex hybrid electronic products.

Access to technical expertise

Not only do you want to find a company that has the technical skills and knowledge to help you design and manufacture hermetic hybrid electronics, you need a partner that gives you direct access to those specialists. Developing the kinds of complex electronic products currently being pioneered in the oil and gas sector requires a process of continuous collaboration, knowledge sharing and testing. You want to work with an OSAT organisation that allows you to build direct working relationships with its technical specialists.

Track record in complex microelectronic engineering

The oil and gas sector is breaking new ground in the development of electronics used for monitoring in-situ drilling and well barriers. Drill monitoring places electronic devices in high-temperature, high-vibration environments, while devices used to monitor well barriers can be encased in concrete for up to 15 years, meaning long-life reliability is key. In aerospace, clients are looking to develop near-engine controllers, which must operate reliably in extremely high-temperature locations.

Choosing an OSAT partner to manufacture products for these applications means finding a provider with experience in designing and manufacturing similarly complex devices.  A partner with a proven track record in comparable high-performance applications such as the defence, aerospace or space sectors. A successful long-lasting partnership can be achieved by choosing a partner with a proven track record of consistently delivering high-quality results and ongoing improvements in yield above 98%.

Materials and component knowledge

Manufacturing hybrid electronic systems to deliver high reliability at high temperatures requires an in-depth knowledge of materials and components. You need a partner who knows how to specify the right materials and components to prevent intermetallic contamination, reduce the risk of corrosion and maintain structural integrity in harsh operating conditions – for many years.

Compliance with challenging standards

Look for an OSAT partner that can manufacture and test microelectronics to the strictest regulatory standards. For oil and gas applications, your partner needs to work to Advanced Well Equipment Standards (AWES) as a minimum. Existing military (MIL) standards provide a more robust framework, but the demands of high-temperature applications above 150°C mean your OSAT partner will need to work to standards that go beyond MIL. You need a partner that has the most rigorous in-house testing capabilities, which can be customised to meet challenging standards and achieve external qualifications. Full traceability throughout the process is critical, as is a facility that provides full compliance for secure or classified materials.

Agility and adaptability

Requirements and expectations for control and monitoring equipment move quickly in the oil and gas sector, where these components are in their infancy. Choosing an OSAT partner that combines design and manufacturing excellence with the ability to customise processes quickly in response to new challenges will help to keep you ahead of the competition. Look for a partner that allows you to work engineer-to-engineer, giving you the flexibility to innovate at pace. Such mutually supportive teamwork is essential in an industry that is constantly pushing the boundaries of microelectronics.

End-to-end capabilities – from design to testing

Your ability to collaborate, innovate, optimise efficiencies and achieve repeatable standards will be greatly enhanced if you choose an OSAT partner that offers complete end-to-end capabilities in-house. That means finding a partner with design, manufacturing and testing expertise and facilities under one roof. If your partner also has excellent supply chain connections and close working relationships with materials suppliers, the risks of delays and interruption to production processes are significantly reduced. When it comes to RF products, it’s crucial to choose an RF partner for OSAT work because of their complicated nature. The OSAT partner must have the necessary skills and facilities to ensure maximum success.

Proven OSAT solutions with Filtronic

At Filtronic, we have been working with technical leaders in some of the most demanding industries for many years, helping them to manufacture precision hybrid microelectronics to exacting standards. Our process understanding sets us apart in the market – we recognise that achieving high reliability requires not just excellence in design but also in processing.

With all this expertise in-house, we have the capabilities to manufacture complex electronics to repeatable standards for applications where thermal management and reliability are paramount. This has enabled us to build collaborative working relationships with industries that are pioneering new applications for hybrid semiconductor modules.

If you are looking for an OSAT partner for a challenging application like Oil & Gas or Aerospace, or if you are looking for a market leading RF OSAT partner, contact the specialists at Filtronic who can offer the expertise and advice you need.

Find out more about Filtronic’s capabilities:

• RF Solutions for Public Safety Critical Communications
• Aerospace and defence applications
• Telecommunications
• RF Solutions for Space
• RF Testing and Measurement

The post When looking for an Outsourced Semiconductor Assembly and Test (OSAT) partner for high-temperature, high-reliability electronics production, there are several factors to consider appeared first on Filtronic.

Among the world’s largest economies, India has long been regarded as an underexploited market for telecommunications. With India’s cities having a high proportion of young, technology-literate residents, it is something of an anomaly that the country’s statistics for fixed and mobile broadband connections still remain relatively low. A key reason for this is that, due to its large land mass and widely-distributed population, it has proved difficult to connect much of the country with fibre, and indeed there has also been a historically low level of telephone and Internet connections over copper. A 2019 report by GSMA^[1] estimated that India then had just 1.5 million kilometres of optical fibre cable, with less than a quarter of its mobile masts connected by fibre, meaning that Indian operators are more reliant on microwave backhaul than many other countries.

5G deployment  

In a June 2022 report^[2] commissioned by Ericsson, Omdia found that 52% of Indian enterprises it surveyed expressed a wish to start using 5G services within the next 12 months. Figure 1 from the same report demonstrates the significant growth of 5G within India from 2023 onwards. With the lack of installed infrastructure, using wireless backhaul links to roll out 5G networks is an obvious way to move forward, and is likely the only way to start addressing this huge demand. In recognition of this, and following petitions^[3] from the ITU APT Foundation of India to the country’s Telecom Minister, there are now plans^[4] by the Indian Department of Telecommunications to open up the spectrum at E-band (71 – 76 GHz and 81 – 86GHz) for backhaul, to support 5G network rollouts. At the same time they are delicensing V-band for WiFi services. These bands may be allocated via an auction process, or possibly by an alternative method of allocation, but a spectrum charge is expected to be applied to the network operators.

UK-India collaboration

The potential of the Indian market has also attracted the attention of the UK Government. Back in October 2021, UK Research and Innovation (UKRI) announced^[5] that it was funding two collaborations between the UK and India, aimed at boosting 5G networks and future generations of telecoms. One is a grant to the Compound Semiconductor Applications Catapult to explore opportunities for further collaboration. The second is the UK-India Future Networks Initiative (UKI-FNI), a £1.4 million project involving UK and Indian universities and led by the University of East Anglia. The main aim of the project is to build relationships between the two countries towards increasing capability and capacity in 5G, and in developing telecoms diversification technologies for 5G and beyond. It is also intended for India and the UK to jointly develop a roadmap and research strategy for 5G and 6G, funded by UKRI India and UKRI’s Engineering and Physical Sciences Research Council (EPSRC).

Diversification

A key path toward diversification is the OpenRAN movement, under which the key elements of the radio access network (RAN) can be separated or disaggregated into individual elements. These can be sourced from a wider range of suppliers, and offers an approach that is likely to be favoured in India as the country starts to build up its own domestic telecoms supply chain.

The key functional elements of the RAN – the Radio Unit (RU); the Distributed Unit (DU); and the Central Unit (CU) – need to be connected with each other via either optical fibre or an ultra-high-capacity wireless link, with the new connection between the RU and DU being called fronthaul, and that between DU and CU being named midhaul, as shown in Figure 2. Together with backhaul, these links are collectively known as Xhaul.

Suitability of E-band for Xhaul

Filtronic has been delivering E-band transceivers for backhaul for several years, and believes that wide-bandwidth mmWave radios represent the optimum solution to meet the increasing capacity demands for all types of Xhaul in 5G communications systems and beyond.^[6] The proven ability of mmWave links to provide an equivalent capacity to fibre — up to 40 Gbps in multichannel configurations, over distances of up to 10km — combined with their ease and comparative low cost of deployment make them ideal for helping India meet its demanding telecoms market needs.

References

[1] “India: Becoming 5G-Ready”, 2019, GSMA, https://data.gsmaintelligence.com/api-web/v2/research-file-download?id=42565634&file=2758-140519-5G-India.pdf

[2] “Mapping 5G’s future in India”, June 2022, Omdia (commissioned by Ericsson)

[3] https://economictimes.indiatimes.com/industry/telecom/telecom-policy/itu-member-body-seeks-opening-of-e-band-for-5g-backhaul-v-band-for-wi-fi/articleshow/89866389.cms

[4] https://economictimes.indiatimes.com/industry/telecom/telecom-news/telcos-to-get-key-e-band-waves/articleshow/93146040.cms

[5] https://www.ukri.org/news/uk-india-collaborations-announced-during-foreign-secretary-visit/

[6] “What Can mmWave Do For 5G Backhaul?”, Mike Geen, 9 October 2019, RF Globalnet https://www.rfglobalnet.com/doc/what-can-mmwave-do-for-g-backhaul-0001

[7] “India’s 5G future: a closer look”, 2022, Ericsson https://www.ericsson.com/en/reports-and-papers/mobility-report/closer-look/india

If you are looking to deploy E-band in India or elsewhere and are looking for the leading transceiver module, diplexer or SSPA, then contact the E-band specialists at Filtronic can offer the expertise and advice you need.

Find out more about Filtronic’s capabilities:

• RF Solutions for Public Safety Critical Communications
• Aerospace and defence applications
• Telecommunications
• RF Solutions for Space
• RF Testing and Measurement

The post How E-band spectrum offers new 5G opportunities in India appeared first on Filtronic.

Reliable access to high-speed, high-volume data communications has the potential to transform many industries and facilitate powerful new applications. These opportunities rely on the continued development of technologies to transmit, receive, and condition radio waves at higher frequencies, alongside the licensing of higher frequency bandwidths to accommodate huge increases in data traffic.

As technology evolves and new frequencies are approved for use, we examine some of the trends and opportunities for industries and applications in the years ahead.

– Space: commoditising satellite production  

To support the rise of mega constellations of low earth orbit (LEO) satellites, RF device manufacturers are developing “off-the-shelf” space-capable high-power products aiming to improve the commercial viability of small satellite manufacture and deployment. The exponential growth in data traffic also means that space communications will need to move further up the frequency band, to E-band (71-76GHz / 81-86GHz) where there is an abundance of bandwidth and technology to support its’ use.

– Telecoms: make space for data

To manage forecasted data traffic, millimetre wave (mmWave) bands at the higher end of the frequency spectrum will need to be licensed for use by telecoms. The semiconductor processes and RF technologies required for W-band (92-115GHz) are well advanced – and will be ready by the time licences are granted. Work is underway to solve the fundamental challenges associated with D-band (138-174GHz), which offers much higher data rates, but requires significant changes to device architecture and advanced device packaging techniques.

– Defence: securing critical communications 

In defence applications, unreliable or interrupted signals caused by congested frequency bands could cost lives. Moving up to higher frequency bands not only offers higher data rates, but also provides more directional signals that are harder to intercept. Alongside this, there is a push towards more digital signal processing in the radar signal chain. New technologies in the pipeline include ultrawide band (UWB) tuneable filters, operating across a broad spectrum of frequencies, which will be used to capture highly accurate spatial and directional data. 

– Trackside-to-train: data on the move

The quest to provide reliable Wi-Fi on trains continues, and the UK has set targets for on-train data speeds. Creating high-data wireless environments on vehicles travelling at high speed poses significant technology challenges. Filtronic has developed a number of demonstration transceivers, which are now being trialled worldwide. These are successfully delivering E-band links to trains and could be commercially available in the next few years.

– High-frequency trading: gaining the competitive edge    

High-performance private wireless networks are starting to be used to improve the competitiveness of high-frequency trading. Wireless point-to-point radio links can transmit signals milliseconds faster than fibre-optic cables. In such high-frequency trading where decisions are made by machine learning, the ability to make decisions a fraction of a second faster than the competition delivers a real competitive advantage.

– Quantum computing: solving complex challenges

The microwave circuits in quantum computers operate at superconducting temperatures, and are particularly sensitive to electromagnetic interference. Filtronic has developed advanced microwave filters to overcome this critical problem. RF technologies offer further potential to solve some of the unique challenges associated with quantum computing.

– Remote surgery: enabling precision operations 

It’s now possible for surgical procedures to be carried out by specialist surgeons remotely – potentially enabling top surgeons to operate on patients in areas where local expertise is not available. Carrying out such precise procedures remotely requires ultra-reliable data connections with extremely low latency (lag) – which could be made possible in the near future by the transition to higher-frequency mmWave bands.

– Autonomous vehicles: unlocking future mobility

Driverless car technology is another advancement requiring extremely reliable, uninterrupted signals with low latency. Delivering this capability across road systems requires a dense network of transmit and receive functions, ideally at mmWave frequencies. Such reliable data connectivity could also be used for intelligent traffic light controls and other smart traffic-management solutions.

The future for RF technology

In all industries and applications, there is a hunger for more and faster data – which means moving signals higher up the frequency spectrum into the uncongested mmWave bands. As you move up the frequency spectrum, transmit and receive components become smaller and devices become more complex and integrated. Thermal management becomes an issue, and there is a need to increase power. All of this presents considerable challenges for advanced RF device designers and manufacturers.

At Filtronic, we enable the future of RF, microwave and mmWave communication, striving to optimise the size, weight and power of transceivers, power amplifiers, filters, combiners and other devices. We are leading the way in anticipating trends and developing the products required to unlock the future possibilities of high-frequency RF applications.

If you have a novel application or process that relies on high-speed, low-latency data communications, the RF specialists at Filtronic can offer the expertise and advice you need.

Find out more about Filtronic’s capabilities:

• RF Solutions for Public Safety Critical Communications
• Aerospace and defence applications
• Telecommunications
• RF Solutions for Space
• RF Testing and Measurement

The post Future focus: new possibilities for RF communications appeared first on Filtronic.

They say that trust is hard-earned, and easily lost and this maxim lies at the heart of any successful business relationship.

Hard-earned trust accumulated by Filtronic over many years of innovative RF design enables us to have those open, honest two-way conversations with customers that only genuine partners can have. When you’re developing high-performance RF solutions at the cutting-edge of technology, such partnership working is critical. Real innovation in technology can only be achieved if there is 100% trust between both parties.

So how do you earn trust in such performance-critical markets? And, once earned, how do you retain it?

History of success

One key factor in establishing your reliability and trustworthiness as a partner is having a proven track record. If you have heritage as a business, it’s one of the most powerful ways to demonstrate your capabilities. Our own track record of successful project and technology delivery over 40 years has earned us a reputation for high standards in design, manufacturing and programme management.

Demonstrable expertise

Next, you need to have expertise that adds value to your customer relationships. Trust is built on performance. Our own customer research has shown that our engineers really differentiate themselves by their levels of expertise. That is the essence of trust – customers trust you as a supplier to bring the specialist expertise they don’t have in-house to solve their specific business challenges.

Independent accreditations

Independent accreditation is an important way to build trust with customers. It’s particularly important when you’re dealing with industries where security and confidentiality are non-negotiable. For example, at Filtronic we have the highest-level security accreditation required to work on defence and aerospace technologies. To achieve this accreditation, our processes, procedures, data management and documentation are rigorously audited to verify their compliance with international standards.  

Protecting ideas

Trust is the bedrock of any partnership that requires ideas or intellectual property (IP) to be shared. Developing new RF technologies means bringing together our background IP with the background IP of our customers, so we can create something new. Customers need reassurances that knowledge will be shared in complete confidentiality. That’s especially relevant when we are dealing with different customers in the same industry. We follow robust practices to ensure that any component we develop or customise for a specific customer remains unique to them.

Innovation know-how

When you’re developing ground-breaking new technologies, customers need partners who will be honest and frank. It’s easy for customers to be seduced by the idea of a new innovation that appears to answer all their problems. But with our expertise and long experience in product development, we bring a dose of realism to the innovation process.

Having been through the iterative steps required to create new products, we know what’s feasible, how long it takes, and how to navigate hurdles along the way towards full scale manufacturing – so we can set realistic expectations and advise customers accordingly.

Big-picture thinking

Customers trust us to deliver technology that is fit for its specific purpose, reliable, and reproducible consistently in a manufacturing environment. We can do this because we have design, manufacturing and testing specialists all under one roof. It means our product designs have high-volume, high-yield manufacturing in mind from the outset, ensuring they are built for real-world applications. Our breadth of expertise enables us to guide customers through the transition from an R&D prototype to a precision product that can be manufactured at scale.

Creativity and adaptability

Trust is also earned in difficult or fast-changing circumstances. In recent years, we’ve seen trust grow in our ability to deliver on our promises at a time of supply chain disruption and global upheaval. Throughout this period, we have found ways to hit deadlines and meet deliverables by being adaptable and thinking differently to solve problems.

Early intervention

One thing we have learned from successfully delivering high-performance technologies over four decades is that the sooner customers bring our expertise into any programme, the better the outcome. Time to market for new technology introduction is critical and making the difficult design decision early in the process can help to ensure that delivery milestones are achieved. Even if we prove not to be the right provider to deliver the project, we can offer essential advice and insights at the inception to save time, resources and effort further down the line.

If you have a communication technology project in mind, don’t waste time trying to solve problems for which you have limited specialist expertise in-house. Filtronic can be trusted to offer the impartial expertise you need to set your project on the right track.

Find out more about Filtronic’s capabilities:

• RF Solutions for Public Safety Critical Communications
• Aerospace and defence Applications
• Telecommunications
• RF Solutions for Space
• RF Testing and Measurement

The post Why trust is the cornerstone of successful collaboration appeared first on Filtronic.

Recent world events and an increase in geopolitical uncertainty has resulted in a renewed focus on building, supporting and strengthening of sovereign supply chains. UK businesses want to build robust, and resilient networks of suppliers, particularly in high-tech sectors. While government and national security agencies are keen to ensure that capability, technology and resources critical for national security remain available within the UK. Coupled with this there is a desire – fuelled by government incentives – to tap into the expertise, innovation and agility of SMEs to build UK competitiveness.

Security begins at home

There are sound economic, commercial and political reasons for investing in our UK supply chains, particularly in the current global climate. Alliances are shifting and the status quo is being upended due to global supply shortages. All catalysts which can quickly disrupt economies and previously well established and stable business models. Sourcing goods, services and expertise from within the UK minimises the risk of disruption and builds a self-sustaining business ecosystem – better able to withstand external shocks and geopolitical upheaval.

By ensuring we have the capability within the UK SME base to deliver advanced, hi-tech components and products, we can better support future-facing UK industries. Building this capability helps to protect local industries and jobs, while enabling businesses to design, develop and deliver truly innovative solutions entirely within the UK.

Thriving SME ecosystem

The good news is that the skills, expertise and capability already exist within the UK start-up and SME community. Many SMEs have impressive track records in their specialist fields and are developing world-leading capabilities in emerging technologies.

Filtronic is among those pioneering companies. We have been designing, manufacturing and testing advanced radio frequency (RF) technologies for more than 40 years. With the proliferation of communication channels and devices, there is huge demand for high-performance RF components to develop UK mobile telecommunications infrastructure, aerospace and defence systems and space capabilities. Within all of these industries, there is a strong motivation to invest in UK supply chains.

Smaller suppliers – bigger opportunities  

Like other leading SMEs, Filtronic offers significant benefits to our supply chain partners. Firstly, we have a broad reach across several markets, which gives us the volume of orders and throughput to support innovative projects. For example, we produce thousands of modules per month for the telecoms sector, enabling us to invest in advanced precision manufacturing equipment. This allows us to develop high-performance components for lower-volume, higher-value defence, aerospace and space projects. We also apply lessons learned in one market to support innovation in others.

As an SME, we are willing to take on more challenging projects. We have a culture of pushing the performance boundaries, being flexible and adapting to specific customer needs. We can customise our components and services for individual projects.

Powered by ingenuity 

Innovation is led by our multidisciplinary engineer team that includes RF, mechanical, PCB, test engineers and process engineers – giving us the breadth of capability required to take on ambitious turn-key projects that require real ingenuity.

Another significant benefit offered by Filtronic, and SMEs like us, is the vertical integration of our business. We can manage projects from design through manufacturing and testing seamlessly within our organisation. The size of our business means that communication and collaboration between different specialists is constant, and everyone understands their role in delivering complex projects. Such close collaboration ensures projects run as smoothly as possible and enables us to adapt and respond at speed.

UK-based world beaters

Many SMEs offer a unique combination of skills and capabilities. That is true of Filtronic, where we combine a rich track record in RF innovation with market-leading engineering expertise. We have also established a position at the vanguard of mmWave technology for next-generation communications. It all adds up to unique offering in the UK.

Like other businesses in the UK SME ecosystem, we are world leaders in what we do. Our technologies are vitally important to some of the UK’s biggest development projects. SME’s like ours deliver the essential building blocks that make the modern world go round – all designed, made and delivered in the UK.

Find out more about Filtronic’s capabilities:

• RF Solutions for Public Safety Critical Communications
• Aerospace and defence Applications
• Telecommunications
• RF Solutions for Space
• RF Testing and Measurement

The post UK supply chains: Why SME suppliers are the driving force of UK growth appeared first on Filtronic.